With the help of the second phase of the big fund, will the local semiconductor packaging and testing industry lead the way?

The second phase of the National Integrated Circuit Industry Fund has begun to invest substantially. The second phase of the fund will provide strong support for enterprises with existing layouts in the fields of etching machines, thin film equipment, testing equipment, cleaning equipment, etc., and help leading enterprises to consolidate their positions. Continue to expand the market. In addition, it can help domestic equipment to provide process certification conditions and build a good reputation and brand, and ultimately achieve domestic substitution of imports.

Basic Concepts of semiconductor Packaging and Testing

The semiconductor industry chain includes chip design, chip manufacturing, packaging and testing, etc., and the downstream covers various industries. In addition, providing service support for the industry chain includes companies that provide IP cores and EDA design tools for chip design, and companies that provide equipment and material support for manufacturing, packaging and testing.

With the help of the second phase of the big fund, will the local semiconductor packaging and testing industry lead the way?

Integrated circuit packaging and testing includes two links: packaging and testing. Packaging is to protect the chip from damage caused by physical, chemical and other environmental factors, enhance the heat dissipation performance of the chip, realize electrical connection, and ensure the normal operation of the circuit; the test is mainly for chip products. Function and performance testing, etc., to screen out products whose functions and performance do not meet the requirements. At present, packaging technology is gradually evolving from traditional lead frame and wire bonding to advanced packaging technologies such as flip chip, through silicon via, embedded packaging, fan-in/fan-out wafer-level packaging, and system-in-package. The size of the chip continues to shrink, the number of pins increases, and the level of integration continues to improve. There are different process flows for different packages, and relevant tests are required to ensure product quality during and after packaging.

Development Trend of Semiconductor Packaging and Testing Industry

Semiconductor products are developing from two-dimensional to three-dimensional. From the direction of technological development, new packaging methods such as system-level packaging have emerged for semiconductor products. From the technical realization method, flip-chip, bump, wafer-level packaging, 2.5D packaging, 3D Packaging and other advanced packaging technology.

SoC: The full name of System-on-chip, system-on-chip, is a highly integrated chip product with different functional circuits in the chip.

SiP: The full name of System-in-package, system-in-package, is to integrate a variety of functional chips, including processors, memory and other functional chips in one package, so as to achieve a basically complete function.

With the slowdown of Moore’s Law, the semiconductor industry has gradually entered the post-Moore era. Both SoC and SiP are ways to achieve higher performance and lower costs. Generally speaking, in terms of integration, SoC has higher integration, lower power consumption, and better performance; while SiP has the advantages of higher flexibility, wider compatibility, lower cost, and shorter production cycle. . Therefore, in the face of products with a relatively long life cycle, SoC is more suitable. For products with short life cycle and small area, SiP has more advantages and higher flexibility.

Furthermore, the traditional packaging concept has been around since the original triode in-line period. The traditional packaging process is to cut the wafer into dice, make the dice stick to the island of the corresponding substrate frame, and then use the wire to connect the bonding pad of the wafer to the pin of the substrate to achieve electrical connection, and finally use case is protected. Typical packaging methods include DIP, SOP, TSOP, QFP, etc.

The future of the local packaging and testing industry has come

The semiconductor industry mainly includes three parts: circuit design, wafer manufacturing and packaging and testing, and packaging and testing is the last link in its industrial chain. Testing runs through the entire semiconductor production process, so it is also the key to improving chip yield. link.

Although my country’s IC R&D design and wafer manufacturing process still lag behind foreign mainstream manufacturers, the semiconductor packaging and testing industry has started early, and its development level has not lagged behind the world’s advanced level. According to relevant statistics, in the first half of 2019 alone, the sales of my country’s semiconductor packaging and testing industry reached 102.2 billion yuan. Since 2004, the compound annual growth rate of my country’s semiconductor packaging and testing industry has also been as high as 15.8%. The data as of the first three quarters of last year also showed that the combined market share of the three major local manufacturers – Changjiang Electronics Technology, Huatian Technology and Tongfu Microelectronics has reached about 28.1%.

With the successive investment of the first and second phases of the National Fund, the value of the semiconductor packaging and testing sector will be further enhanced. It is understood that the second phase of the National Fund will start real investment at the end of March. Different from the first phase, the second phase of the big fund will pay more attention to the investment in semiconductor materials and semiconductor equipment, which will bring new opportunities for the semiconductor packaging and testing industry.

Under the vigorous promotion at the national level, the domestic semiconductor industry will usher in a new round of expansion. According to statistics, by 2020, 18 semiconductor projects will be put into construction in the world, 11 of which will be concentrated in China, and the total investment scale will reach 24 billion US dollars. The continuous emergence of semiconductor projects and the successive release of production capacity will bring greater demand to the packaging and testing industry.

It is not only the packaging and testing service providers who benefit, but also the upstream packaging and testing equipment suppliers. Some industry insiders pointed out that compared with companies that provide packaging and testing services, the value of their upstream packaging and testing equipment suppliers has not been valued. At present, the packaging and testing equipment suppliers that can be concerned in the A-share market are mainly concentrated in Changchuan Technology and Huafeng Measurement and Control, but compared with packaging and testing services, the field has not yet formed a pattern of “several dominance”, which means that some have not yet landed “Potential stocks” in the capital market still have the opportunity to compete for the right to speak in the market.

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