Renesas Electronics Announces Development of Next-Generation Wireless MCU Supporting Bluetooth Low Energy 5.3

Tokyo, Japan, October 21, 2021-Global semiconductor Solution ProviderRenesas ElectronicsThe Group (TSE: 6723) announced today that it will develop a new microcontroller (MCU) to support the recently released Low Energy (LE) Bluetooth® 5.3 specification. The new product will become an important part of the Renesas Advance (RA) 32-bit Arm® Cortex®-M microcontroller product family. It will join the RA4W1 Bluetooth 5.0 LE product lineup launched last year. The first samples will be launched in the first quarter of 2022.

Renesas Electronics Announces Development of Next-Generation Wireless MCU Supporting Bluetooth Low Energy 5.3

(Photo provided by the enterprise)

The new Bluetooth 5.3 specification was released on July 13, 2021, and includes a number of important functions: for example, allowing the receiver to filter information without passing through the host stack to improve the receiver’s duty cycle; allowing peripheral devices to send to the central device Open up the preferred channel to improve throughput and reliability; add secondary connections to improve the switching time between low-duty-cycle connections and high-duty-cycle connections for applications that occasionally need to switch to burst traffic. In addition, the new MCU also supports the direction search function introduced in Bluetooth 5.1, and the synchronization channel added for stereo audio transmission in Bluetooth 5.2. The inclusion of software-defined radio (SDR) functionality will allow customers to continuously update to new versions.

Renesas has a long history and deep expertise in Bluetooth development and low energy Bluetooth device design. The new products will support the “RA Product Family Flexible Configuration Package” (FSP) that can simplify development, as well as the development of Bluetooth profiles and applications The dedicated tool “Renesas QE for Bluetooth LE plug-in”. The new product also supports the advanced security assurance mechanism of the RA product family such as TrustZone.

Roger Wendelken, senior vice president of Renesas’ Internet of Things and Infrastructure Business Division, said: “We are committed to creating outstanding performance, ease of use and the latest features for the market. By providing early and strong support for the Bluetooth 5.3 LE specification, we can Help Renesas RA customers to bring their next-generation products to the market as soon as possible.”

Renesas combines the new low-power Bluetooth 5.3 MCU with its supporting analog, power and clock devices, and plans to launch a variety of “successful product portfolios.” The “Successful Product Portfolio” builds an easy-to-use architecture to simplify the design process and significantly reduce the design risk of various applications for customers.

Supply information

The new MCU under development will use advanced manufacturing processes to bring high performance, low power consumption and small package options. Samples will be launched in the first quarter of 2022. For more information about Bluetooth Low Energy ® 5.3, please read the blog post New Features of Bluetooth ® 5.3 Low Energy.

About Renesas Electronics Group

Renesas Electronics Group (TSE: 6723), provides professional and credible innovative embedded design and complete semiconductor solutions, aiming to improve people’s work and lifestyle through billions of connected smart devices using its products. As a global supplier of microcontrollers, analog, power supplies, and SoC products, Renesas Electronics provides comprehensive solutions for various applications such as automotive, industrial, home, infrastructure, and Internet of Things, and we look forward to working with you to create an infinite future.

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